Vansim (Dongguan)Hardware Products Co., Ltd.
How to start your custom solution with Vansim's process
The purpose of thermal design is to control the temperature of all electronic components inside the product so that it does not exceed the maximum temperature specified by the standards and specifications under the working environment conditions. Thermal design is inseparable from logic design, structural design, etc. Putting thermal design at the end to do heat dissipation is not called thermal design, it is just a heat dissipation remedial measure, which is not conducive to the company's process and wastes company resources.
CUSTOM
CFD simulation & analysis
System, Board and component-level thermal analysis
Heat sink design and optimization
Modeling of air-cooling, heat pipes, vapor chamber, liquid cooling etc.
DESIGN
CAD Design
3D Solid Modeling
2D Manufacturing Drawings
2D to 3D Conversion
Vansim will use its many years of manufacturing experience help you with more reference suggestions.
Contact Us >>1. Establish the project
2. Understand the working environment of the equipment
(including indoor or outdoor, ambient temperature and noise requirements, etc.), determine the equipment size, configuration, total power consumption, thermosensitive devices and concentrated heating devices
3. Select thermal design method
In short, a complete thermal design process should include the determination of the system cooling solution, detailed analysis and design, prototype testing, etc. It is a closed-loop process that is repeated and verified multiple times.
3.1 Thermal calculation
Thermal calculation (system level): When the equipment is simple or the heat distribution in the system is uniform, thermal calculation can be performed directly;
3.2 Thermal simulation
Establish a simulation model, assign attributes and loads, set boundary conditions and control parameters for solution, divide the grid, solve, and display the results.
3.3 Thermal test or thermal simulation test
When improving the design, thermal test can be carried out directly;
In important designs, existing similar equipment can be used or similar equipment can be made to carry out thermal simulation test.
4. Thermal design results
In natural convection:
The position, size and opening ratio of the inlet and outlet mesh
If a radiator is required, the results of radiator optimization
For forced convection: Select the model, quantity, and installation location of the fan Determine the size, location, and opening rate of the air inlet and outlet mesh If a radiator is required, the result of radiator optimization Others: such as the design of the air guide plate, the arrangement of components, etc.
5. Prototype production and testing
Based on the design parameters, make samples and test and verify
6. Determine whether the design requirements can be met If the requirements are met
the design is completed , and mass production development and introduction will be carried out later according to the demand conditions; If the requirements are not met, return to step 3, reselect the design plan, and continue to execute.
Vansim Liquid cooling plate Leakage Test
Purpose of Leakage test
The liquid cooling plate is an important part of the night cooling system. Once a leak occurs, it will cause a serious accident. The night cooling plate must be 100% airtight before shipment to ensure the reliability of the night cooling plate in use.
At present, there are many airtight test methods, and the more commonly used ones are water immersion leak detection, pressure leak detection, and helium mass spectrometer leak detection. Each method has its scope of application and advantages and disadvantages. During the detection process, it is necessary to select the appropriate leak detection method and gas source according to the actual situation and requirements.
Leak detection by immersion method
After filling the liquid cooling plate with gas of a certain pressure, seal the inlet and outlet of the liquid cooling plate, immerse the entire plate in water, and observe with the naked eye whether there are bubbles overflowing from the surface of the liquid cooling plate to determine whether the liquid cooling plate is leaking.
Advantages:
1. Easy to operate, low equipment and production input costs,
2. Intuitive detection, can quickly and accurately find the leak point for repair
Disadvantages:
1. Manual judgment is required, there is a possibility of manual misjudgment
2. The product will be soaked in water, and water stains need to be removed
Thermal Simulation
The purpose of thermal design is to control the temperature of all electronic components inside the product so that they do not exceed the maximum temperature specified by standards and specifications under the working environment conditions.
K142 Liquid cold plate thermal solution
Solution1:Power :=150*6+180*6=2640w; Al6061 plate Input flow rate 0.004m³/min ( 4L/Min) Environment 55℃ Liquid cold plate surface Max temperature is below 55 ℃ The temperature difference of the same chip type is about 3 ℃
3400W Skived fin heat sink thermal solution
Mode:Power 3*300W+6*420W=3420W; Al1060 + Heat pipes Input flow rate 8m/s Environment 35℃ The Max temperature of heat sink surface is below 85 ℃
Liquid cooling plate pressure simulation case
Apply simulation software to analyze the mechanical properties of the liquid cooling plate, and analyze in detail the deformation and stress distribution of the liquid cooling plate under internal pressure load conditions, so as to evaluate the rationality of the liquid cooling plate structure design and the friction welding span of the upper cover plate, and provide a theoretical basis for the optimal design of the liquid cooling plate structure.
Electronic equipment thermal simulation case
Analyze the pressure, flow rate and temperature distribution of the whole equipment in detail to provide a theoretical basis for the heat dissipation optimization design of the equipment; design the heat sink and heat dissipation solution to meet the following requirements -At an ambient temperature of 50℃, the device surface temperature is lower than 95℃.
Liquid Cooling Plate Thermal Simulation Case
Use simulation software to design liquid cooling plates to meet performance requirements, analyze the pressure, flow, and temperature distribution in the entire liquid cooling system in detail, and provide a theoretical basis for the optimal design of the liquid cooling system
Heat sink thermal simulation case
Use simulation software to design the heat sink and select the appropriate fan to meet the product's heat dissipation performance requirements
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