Vansim (Dongguan)Hardware Products Co., Ltd.
Electronic equipment thermal simulation case
Jan 03,2025
1. Hot design objective
Detailed analysis of the pressure, flow rate, and temperature distribution throughout the entire device, providing theoretical basis for the optimization design of the device's heat dissipation; Design heat sinks and cooling solutions that meet the following requirements
-At an ambient temperature of 50 ℃, the surface temperature of the device is below 95 ℃.
2. Design Information
- Application conditions
Cooling method: natural heat dissipation
Environmental temperature: 50 ℃
Material of radiator: AL6063
Shell material: Nylon-66
Power distribution: as shown in the following figure
3. Thermal simulation model
Thermal analysis model
4. Scheme and simulation
1. Original plan
Explanation of heat dissipation scheme
PCB temperature cloud map
Equipment surface temperature cloud map
2. Optimization plan (adding ventilation holes)
Explanation of heat dissipation scheme
PCB temperature cloud map
Equipment surface temperature cloud map
Equipment flow field diagram
5. Conclusion
Summary of simulation data
| Serial Number | Scheme
| Cellular module
Temperature ℃ | App Processor
Temperature ℃ | Equipment surface
Temperature ℃ |
| 1 | Original scheme | 98.4 | 92.8 | 79.1 |
| 2 | Optimization plan (adding ventilation holes) | 79.7 | 76.3 | 66 |
Conclusion&Suggestions
According to simulation analysis, the heat flux density in a closed electronic device system is relatively high, which makes it difficult to effectively exchange heat with the outside world, and the heat cannot be quickly dissipated outside the system, resulting in an increase in the internal temperature of the device; After adding ventilation holes to the equipment, the temperature inside and on the surface of the equipment decreased significantly.
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