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The bonded heat sink was originally designed to solve the problem that the heat sink fins and substrate materials are different, and the high, dense, and thin heat sinks are difficult to form by other methods. However, with the development of tooth-slotting technology, many insert heat sinks have been replaced by the tooth-slitting process. The fins-slitting process can make the fin thinner, higher, and smaller than the insert, and the fins and substrate are a whole, with excellent heat transfer performance and simple processing technology. However, the insert heat sink still has irreplaceable advantages in the design of certain scenarios or special situations. For example, local inserts of complex heat sinks, inserts of special shapes, inserts on the front and back, inserts on double substrates, etc.

COPPER BASE PLUS ALUMINUM FIN HEATSINKS 

ALUMINUM BASE PLUS ALUMINUM FIN HEATSINKS 

ALUMINUM BASE PLUS COPPER FIN HEATSINKS 

COPPER BASE PLUS COPPER FIN HEATSINKS 

Matched ways for the bases and the fins:

Applications are requiring increasingly higher power density, which often exceeds the cooling limits of conventional extruded aluminum heat sinks. This has driven the need for a heat sink that can meet the increased performance demand.  bonded fin heat sinks dissipate more heat than extruded aluminum heat sinks of the same footprint because they allow for taller fin heights and tighter fin spacing. The higher fin densities and fin aspect ratios provide a greater surface area.

Pure aluminum fins offer 15 percent better conductivity over extruded fins Bonded fin heat sinks can be offered with a fin height to fin spacing ratio of 30:1 or higher (compared to 20:1 max for extruded fins) Customizable designs are available depending on need Allows for variable fin spacing Optimized thermal transfer from base to fins