Vansim (Dongguan)Hardware Products Co., Ltd.
How does the embedded heat pipe heat sink worked for high power IGBT cooling ?
1. Key Challenges in High-Power IGBT Cooling
- Junction Temperature Limitations: IGBTs have a maximum junction temperature (typically 150–200°C), beyond which reliability degrades rapidly.
- Non-Uniform Heat Distribution: Hotspots form near the die attach points or bonding wires, leading to thermal stress and potential failure.
- Size and Weight Constraints: Compact designs are required for applications like electric vehicles (EVs) or aerospace systems.
2. Structure of Embedded Heat Pipe Heat Sinks for IGBTs
Core Components:
- Base Plate with Embedded Heat Pipes:
- The base (usually copper or copper-aluminum composite) is directly attached to the IGBT module’s underside.
- Heat pipes (copper with wicks) are embedded within the base, running perpendicular to the heat flow direction to quickly carry heat away from the IGBT’s hotspots.
- Heat Dissipation Section:
- Fins or Cold Plates: Extruded/aluminum fins, skived fins, or flat plates (for forced air or liquid cooling) are integrated with the heat pipes’ condenser section.
- In forced air systems, fins are densely packed (e.g., 2–5 mm spacing) to maximize convective cooling. In liquid-cooled systems, the heat pipes may terminate in a cold plate with microchannels.
- Thermal Interface Materials (TIMs):
- Gap pads, thermal grease, or phase-change materials (PCMs) with high conductivity (≥5 W/m·K) ensure efficient heat transfer from the IGBT to the base plate.
3. Working Principle for IGBT Cooling
Step 1: Heat Absorption at the Base
- The IGBT module’s heat (generated primarily in the silicon die) is conducted through the module’s ceramic substrate (e.g., AlN, Al₂O₃) and metal baseplate to the heat sink’s base.
- The embedded heat pipes absorb this heat at their evaporation zone (in direct contact with the IGBT’s hotspots).
Step 2: Heat Transport via Heat Pipes
- Inside the heat pipe, a working fluid (e.g., water, methanol) vaporizes at the hot base, absorbing latent heat.
- The vapor flows rapidly (at near-sonic speeds in high-power pipes) to the condensation zone (cooler fin/cold plate section), driven by pressure gradients and capillary action in the wick.
- This phase change enables heat transport with minimal temperature drop, even over long distances (e.g., 10–30 cm), overcoming the limitations of solid conduction.
Step 3: Heat Dissipation
- In forced air cooling:
- The vapor condenses on the fins, releasing heat to the airflow (generated by fans or blowers). The fins’ high surface area (e.g., 1000–2000 cm² per heat sink) enhances convective heat transfer.
- Cooled liquid flows back to the base via the wick, completing the cycle.
- In liquid cooling (e.g., cold plate integration):
- The heat pipe’s condenser is bonded to a cold plate with internal channels for coolant (e.g., water-glycol). Heat is transferred to the liquid, which is then routed to a radiator.
Step 4: Thermal Management Integration
- Temperature sensors monitor the IGBT junction or heat sink surface, adjusting fan speed or coolant flow to maintain optimal temperatures.
high power IGBT cooling embedded heat pipe heat sink
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