



The Copper Skived Heat Sink is a premium cooling solution designed to deliver exceptional thermal dissipation for high-power electronic devices. Utilizing advanced skiving technology, this heat sink features ultra-thin, tightly spaced fins that maximize surface area, ensuring efficient heat transfer and optimal thermal performance.
Crafted from high-purity copper, the copper skived heat sink offers superior thermal conductivity, significantly outperforming aluminum alternatives. The skived fin design allows for precise control over fin thickness and density, enabling customized cooling solutions tailored to specific applications. Whether used in CPUs, GPUs, power electronics, or LED lighting, this heat sink ensures reliable temperature regulation, extending the lifespan of critical components.
The Copper Skived Heat Sink is ideal for applications requiring compact, lightweight, and high-efficiency cooling. Its robust construction resists deformation under high temperatures, while the natural corrosion resistance of copper ensures long-term durability. Easy to integrate into existing systems, it supports passive and active cooling configurations, making it a versatile choice for engineers and designers.

Key Features & Benefits:
High thermal conductivity – Pure copper construction for rapid heat dissipation
Skived fin technology – Ultra-thin, dense fins for maximum cooling efficiency
Lightweight & compact – Ideal for space-constrained applications
Corrosion-resistant – Long-lasting performance in harsh environments
Customizable designs – Tailored solutions for specific thermal requirements
Upgrade your thermal management system with the Copper Skived Heat Sink – the ultimate solution for high-performance electronics cooling.




High density copper skived heat sink for data center liquid cold plate
Contact Us
Classification
Related Products